Nr.	Title	Tentative Presenter
01	European Project SUPERTHEME	J. Lorenz, Fraunhofer IISB
02	Roadmap towards 10FDSOI	Maud Vinet (LETI)
03	Inter-Regional Application Lab - collaborating Academic, Industry and Research Partners in Nanoelectronics	Alexey Ivanov (Russia) coop. IMEC
04	HTA SOI MEMS Platform	P. Pekko (VTT) coop. HTA
05	HTA - a paradigm shift in the European R&D Landscape	George Kotrotsios (CSEM) coop. HTA
06	The photonic sensing and integration platform of the Heterogeneous Technology Alliance (HTA)	Christian Bosshard (CSEM) coop. HTA
07	Traceable characterisation of nanostructured devices by EMRP TReND	Burkhard Beckhoff (PTB Berlin)
08	Traceable Quantitative Surface Chemical Analysis for Industrial Applications	Andreas Nutsch (PTB Berlin)
09	Molecularly Engineered Energy Materials - Energy Frontier Research Center at UCLA	Chi-Ping Liu
10	Introducing the STARnet Functional Accelerated nanoMaterials Engineering (FAME) Center	Kosmas Galatsis (UCLA)
11	Institute for Nanoelectronics Discovery and Exploration (INDEX) center	V.P.LaBella
12	Southwest Academy of Nanoelectronics (SWAN)	Hema Chandra Prakash Movva (U Texas)
13	Systems on Nanoscale Information fabriCs (SONIC) Center	Max Shulaker
14	NSF TANMS program goal, objectives, major thrusts, and most significant results	Joshua L. Hockel (UCLA)
15	Reinventing the future: Moore’s law under a changing environment	Carla Alvial Palavicino (U Twente)
16	Silicon Photonic at CEA-Leti	Laurent Fulbert (LETI)
17	3D ICs, the future of ICs	Patrick Leduc (LETI)
18	Tsukuba Innovation Arena for Nanotechnology (TIA-nano)	S. Iwata (AIST)
19	Tsukuba Power-Electronics Constellations: TPEC	Michiya Okada (AIST)
20	Nanotechnology Platform Japan	Tetsuji Noda (NIMS)
21	International Research Centers and Programs at National Institute for Materials Science	Masahiro Takemura (NIMS)
22	Presentation of the Center for Low Voltage Systems Technology (LEAST)	Hao Lu (University of Notre Dame)
23	Energy Efficiency in Digital Systems	Marc Duranton (LETI)
24	Advanced Printed Electronics Based on Inorganic Materials	Michael Jank (Fraunhofer-IISB)
25	Materials for Power Generation and Storage, Towards an Energy Distributed Society	Chikashi Nishimura (NIMS)
26	Modeling of nanostructured materials for energy storage applications	Maarten Mees (IMEC)
27	Introduction of CRAVITY: Clean room for analog and digital superconductivity	Masahiro Ukibe (AIST)
28	Complementary Methodologies for Thin Film Characterization in one Tool - A novel Instrumentation for 450mm	Ina Holfelder (PTB Berlin)
29	Development of optical elements by nano-replication technology	Kazuma Kurihara (AIST)
30	Simulation as core tool for development of future lithography options	J. Lorenz (Fraunhofer IISB)
31	Deep Ultraviolet Out-of-Band Characterization of EUVL Scanners and Resists	Gian F. Lorusso (IMEC)
32	The need for EUV lithography at advanced technology for sustainable wafer cost	Arindam Mallik (IMEC)
33	Atomic Layer Deposition of Scandium-based oxides	L. Nyns (IMEC)
34	Nanomaterials Based on Manganese Complexes and Manganese Oxides	Noelia Maria Sanchez-Ballester (NIMS)
35	Toward integrated circuits based on ultra-thin body MoS2 & WSe2 two dimensional crystals	Amirhasan Nourbakhsh (IMEC)
36	Phonons in Si Free-Standing Membranes: Towards Phonon Engineering	Clivia M. Sotomayor Torres (ICN2 Spain)
37	New materials discovery and their application for future nano electronics	Toyohiro Chikyow (NIMS)
38	Intercalated Bilayer Graphene Heterostructures towards the BiSFET	Hema Chandra Prakash Movva (U Texas)
39	Oxide Growth, Characterization and Spin Precession Measurement on/in CVD Graphene	Akitomo Matsubayashi (Albany)
40	Low-Voltage Nonvolatile Graphene Memory Based on Ion Transport	Hao Lu (University of Notre Dame)
41	Carbon nanotubes as future generation interconnects	Johannes Vanpaemel (IMEC)
42	Modeling and Simulation of Carbon Nanotubes for Sensor- and Interconnect Applications	Jörg Schuster (Fraunhofer-ENAS)
43	Preparation and Characterization of Carbon Nanotubes based Via Interconnects	Holger Fiedler (Fraunhofer-ENAS)
44	Carbon nanotube integration for piezoresistive electro-mechanical transducers on wafer-level	Sascha Hermann (Uni Chemnitz)
45	Sensor interface circuit using CNFETs	Max Shulaker
46	Experimental Demonstration of a Sensor-to-Digital Interface Built Entirely with Carbon Nanotube FETs	Max Shulaker
47	High-Performance Silicon Nanowire MOSFETs for Ultra-Low Power LSI	Masumi Saitoh (Toshiba)
48	Electrochemical Supercapacitors at the Molecularly Engineered Energy Materials	Chi-Ping Liu
49	Experimental Demonstration and Modeling of Spin Wave Logic Gates	Pedram Khalili
50	Innovations from NSF TANMS: Technical Achievements and Research Overview	Joshua L. Hockel (UCLA)
51	Electrolyte-gated Mott transistor with large switching ratio at room temperature	Isao H. Inoue (AIST)
52	Applying Silver/Polypyrrole Composite on Plastic Substrates for Flexible Electronics	Barbara Horvath (NIMS)
53	Work Function Mapping for Combinatorial Samples using Developed Band Diagram Measurement System under Atmospheric Conditions	Shinjiro Yagyu (NIMS)
54	Combinatorial synthesis of Cu/high-k dielectric oxide stack structure for nanoionics type ReRAM device	Takahiro NAGATA (NIMS)
55	Tunnel field-effect transistors for low-power nano-electronics	Anne Verhulst (IMEC)
56	Alternating Source/Drain Contacts for Ultrashort Gate Length and Non-Symmetric Injection-Controlled Thin-Film Transistors	Michael Jank (Fraunhofer-IISB)
57	CMOS technology development vehicle for bulk FinFET N10/N7	M. Dehan (IMEC)
58	Integration of Single-Photon Avalanche Diodes with low dark counting rate in CMOS technology	Sascha Weyers (Fraunhofer IMS)
59	Impact of Drain-Voltage-Dependent Subthreshold Voltage Reduction on Energy Efficiency of Steep Subthreshold Slope Transistors	Toshiro Hiramoto (Univ. of Tokyo)
60	Integration of Room-Temperature Operating Silicon Single-Electron Transistors and CMOS Circuits for Novel Information Processing	Toshiro Hiramoto (Univ. of Tokyo)
61	Bipolar Resistive Switching Memory Using TiN/Hf/HfO2/Si MIS Structure	Dirk Wouters (IMEC)
62	Development of Hydrogen Diffusion Barrier for Nano- Electronic Nonvolatile Charge Trapping Memory Devices	Nam Nguyen (NIMS)
63	Multi-Step Approach for Thermal Optimization of 3D-IC and Package	Michael Dittrich (Fraunhofer IIS/EAS)
		Back to Top